|
项 目
|
ITEM
|
TECHNICAL PARAMETER
|
|
层数
|
Layers |
2-22(层)Layers |
|
最大加工面积
|
Max.Board Size |
23inch * 35inch |
|
板厚
|
Board Thickness |
0.4-6.0mm |
|
最小线宽
|
Min.Line Width |
0.10mm |
|
最小间距
|
Min.Space |
0.10mm |
|
最小孔径
|
Min.Hole Size |
0.15mm |
|
孔壁铜厚
|
PTH Wall Thickness |
>0.025mm |
|
金属化孔径公差
|
PTH Hole Dia.Tolerance |
±0.05mm |
|
非金属化孔径公差
|
Non PTH Hole Dia.Tolerance |
±0.05mm |
|
孔位公差
|
Hole Position Deviation |
±0.076mm |
|
外形尺寸公差
|
Outline Tolerance |
±0.1mm |
|
开槽
|
V-cut |
30°/45°/60° |
|
最小BGA焊盘
|
Min.BGA PAD
|
14mil
|
|
PCB交流阻抗控制
|
Impedance control PCB |
≤50Ω ±5Ω |
| ＞50Ω ±10% |
|
阻焊层最小桥宽
|
Soldemask Layer Min.Bridge width |
5mil |
|
阻焊膜最小厚宽
|
Soldemask film Min.Thickness |
10mil |
|
绝缘电阻
|
Insulation Resistance |
1012Ω(常态)Normal |
|
抗剥强度
|
Peel-off Strength |
1.4N/mm |
|
阻焊剂硬度
|
Soldemask Abrasion |
>5H |
|
热衡击测试
|
Soldexability Test |
260℃20(秒)second |
|
通断测试电压
|
E-test Voltage |
50-250V |
|
介质常数
|
Permitivity
|
ε=2.1~10.0 |
|
体积电阻
|
Volume resistance |
1014Ω-m,ASTM
D257,IEC60093 |
|
